Double-sided lapping machine-KS25B
Mainly used for polishing metal and non-metal hard and brittle materials.
The thinnest processing thickness is 0.08mm, the parallelism, flatness up to 1um, and the best surface roughness can reach 0.01um.
Mainly used for optical glass, crystal, quartz wafer, sapphire glass, lithium niobate, gallium arsenide, ceramics, sheet ferrite, silicon wafer, valve plate, valve plate, friction plate, rigid sealing ring, cylinder piston ring, oil pump Double plane grinding and polishing of metal and non-metal hard and brittle materials such as blades.
|Model||Lap plate diameter(mm)||Max. processing diameter(mm)||Work station|