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Horizontal high speed thinning machine

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It is used for high-speed thinning of brittle and hard materials such as silicon wafers, ceramics, glass, quartz crystals, sapphire, and other semiconductor materials.

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Model Lap plate diameter(mm) Max. processing diameter(mm)
KJ200L Φ200 Φ200
KJ360L Φ312 Φ360
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