high-speed thinning machine-KJ360L
This thinning machine is mainly used for high-speed thinning of non-metallic and metal precision parts.
This thinning machine is mainly used for high speed thinning of non-metallic and metal precise parts of brittle and hard materials such as silicon wafer, ceramics, glass, quartz crystal, sapphire, other semiconductor materials.
|Model||Lap plate diameter(mm)||Max. processing diameter(mm)|